Shawming, M A: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

1

[IEEE 2018 China Semiconductor Technology International Conference (CSTIC) - Shanghai (2018.3.11-2018.3.12)] 2018 China Semiconductor Technology International Conference (CSTIC) - Study of Plug Etch back process matching on faraday shielded ICP and traditional CCP plasma ETCH chambers

Fu, Yali, Ma, Shawming, Wang, Yi, Xiao, Jammy, Kim, M H, Zhang, Nancy, Jiao, Mingjie, Wang, Frank, Lee, Tammy

Year:

2018

File:

PDF, 1.16 MB

2018

2

Evaluation of plasma charging damage during polysilicon gate etching process in a decoupled plasma source reactor

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1998

Language:

english

File:

PDF, 882 KB

english, 1998

3

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - An evaluation of the HotOzone/sup TM/ process: a new post etch resist and residue removal process

Shawming Ma,, Parker, R., Kavari, R., Leal, I., Boyers, D.G., Cremer, J.T.

Year:

2000

Language:

english

File:

PDF, 450 KB

english, 2000

4

Prediction of plasma charging induced gate oxide damage by plasma charging probe

Shawming Ma,, McVittie, J.P., Saraswat, K.C.

Journal:

IEEE Electron Device Letters

Year:

1997

Language:

english

File:

PDF, 78 KB

english, 1997

5

[IEEE 1994 IEEE International Electron Devices Meeting - San Francisco, CA, USA (11-14 Dec. 1994)] Proceedings of 1994 IEEE International Electron Devices Meeting - Real time measurement of transients and electrode edge effects for plasma charging induced damage

Shawming Ma,, McVittie, J.P.

Year:

1994

Language:

english

File:

PDF, 424 KB

english, 1994

6

SPIE Proceedings [SPIE Microelectronic Manufacturing - Santa Clara, CA (Sunday 20 September 1998)] In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing II - Contact potential difference methods for full wafer characterization of Si/SiO2 interface defects induced by plasma processing

Edelman, Piotr, Savchouk, A., Wilson, M., Jastrzebski, Lubek, Lagowski, Jacek J., Nauka, Christopher, Ma, Shawming, Hoff, Andrew M., DeBusk, Damon K., Ajuria, Sergio A., Hossain, Tim Z.

Year:

1998

Language:

english

File:

PDF, 1.86 MB

english, 1998

7

[IEEE 2019 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2019.3.18-2019.3.19)] 2019 China Semiconductor Technology International Conference (CSTIC) - Inductive Coupled Downstream Plasma CD Trim Process Stability Study

Fu, Yali, Ma, Shawming, Wang, Yi, Sui, Linda, Chen, Lu, Vaniapura, Vijay, Diao, Li, Jiao, Mingjie, Chen, Hongwei

Year:

2019

Language:

english

File:

PDF, 1.91 MB

english, 2019

8

[IEEE The 17th Annual SEMI/IEEE ASMC 2006 Conference - Boston, MA (May 22-24, 2006)] The 17th Annual SEMI/IEEE ASMC 2006 Conference - Control of Contact Hole Distortion by Using Polymer Deposition Process (PDP) for sub-65nm Technology and Beyond

Wang, J., Shing-li Sung,, Shawming Ma,

Year:

2006

Language:

english

File:

PDF, 705 KB

english, 2006

9

Effects of wafer temperature on plasma charging induced damage to MOS gate oxide

Shawming Ma,, McVittie, J.P., Saraswat, K.C.

Journal:

IEEE Electron Device Letters

Year:

1995

Language:

english

File:

PDF, 309 KB

english, 1995

10

[IEEE 1st International Symposium on Plasma Process-Induced Damage - Santa Clara, CA (13-14 May 1996)] Proceedings of 1st International Symposium on Plasma Process-Induced Damage - Prediction of Plasma Charging Induced Gate Oxide Tunneling Current and Antenna Dependence by Plasma Charging Probe

Shawming Ma,, Mcvittie, J.P.

Year:

1996

Language:

english

File:

PDF, 415 KB

english, 1996

11

Process Development of Radical Based Dry Clean for Advanced 3D NAND Fabrication

Wang, Shanyu, Zeng, Wilson, Yan, Chun, Chung, Hua, Lembesis, Pete, Lo, Jack, Ma, Shawming, Pakulski, Ryan, Yang, Michael

Journal:

ECS Transactions

Year:

2019

File:

PDF, 673 KB

2019

12

Sensitivity and limitations of plasma charging damage measurements using MOS capacitors structures

Shawming Ma,, Abdel-Ati, W.L.N., McVittie, P.

Journal:

IEEE Electron Device Letters

Year:

1997

Language:

english

File:

PDF, 84 KB

english, 1997

13

[IEEE 2018 China Semiconductor Technology International Conference (CSTIC) - Shanghai (2018.3.11-2018.3.12)] 2018 China Semiconductor Technology International Conference (CSTIC) - Study of downstream CF4 contained plasma process impact on chamber condition

Fu, Yali, Ma, Shawming, Wang, Yi, Wang, Ken, Jiao, Mingjie, Zhang, Nancy, Vaniapura, Vijay, Phan-Vu, Hai-Au, Elliston, Bob

Year:

2018

Language:

english

File:

PDF, 477 KB

english, 2018

14

[IEEE 2006 International Conference on Simulation of Semiconductor Processes and Devices - Monterey, CA, USA (2006.09.6-2006.09.8)] 2006 International Conference on Simulation of Semiconductor Processes and Devices - Flow Simulation: Advanced Dielectric Etch Equipment Design and Process Development

Bera, Kallol, Carducci, Jim, Hoffman, Daniel, Ma, Shawming

Year:

2006

Language:

english

File:

PDF, 3.23 MB

english, 2006

15

Process Development of Radical Based Dry Clean for Advanced 3D NAND Fabrication

Wang, Shanyu, Zeng, Wilson, Yan, Chun, Chung, Hua, Lembesis, Pete, Lo, Jack, Ma, Shawming, Pakulski, Ryan, Yang, Michael

Journal:

ECS Transactions

Year:

2019

Language:

english

File:

PDF, 673 KB

english, 2019

16

Plasma-parameter dependence of thin-oxide damage from wafer charging during electron-cyclotron-resonance plasma processing

Friedmann, J.B., Shohet, J.L., Mau, R., Hershkowitz, N., Bisgaard, S., Shawming Ma,, McVittie, J.P.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

1997

Language:

english

File:

PDF, 574 KB

english, 1997

17

Limitations of Plasma Charging Damage Measurements Using MOS Capacitor Structures

Shawming, M A, Abdel-Ati, Wael L. N., Mcvittie, James P.

Journal:

MRS Proceedings

Year:

1996

Language:

english

File:

PDF, 397 KB

english, 1996

18

[Widerkehr & Associates 1996 Symposium on VLSI Technology. Digest of Technical Papers - Honolulu, HI, USA (11-13 June 1996)] 1996 Symposium on VLSI Technology. Digest of Technical Papers - Effects of ion energy distribution on topography dependent charging

Kinoshita, T., Shawming Ma,, Hane, M., McVittie, J.P.

Year:

1996

Language:

english

File:

PDF, 245 KB

english, 1996

19

Plasma induced wafer charging sensor

Ma, Shawming, McVittie, James P.

Journal:

Journal of the Chinese Institute of Engineers

Year:

1998

Language:

english

File:

PDF, 886 KB

english, 1998

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@1delivery.pm

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски